TECHNOLOGY/BUSINESS OPPORTUNITY

Precision 3-D Laser Patterning Process

Opportunity: Lawrence Livermore National Laboratory (LLNL), operated by the Lawrence Livermore National Security (LLNS), LLC under contract with the U.S. Department of Energy (DOE), is offering the opportunity to license the technology for a Precision 3-D Laser Patterning Process based on laser pantography.

Background:  Patterning in three dimensions is a difficult problem.   Typical screening and photolithography permits the patterning of two dimensional surfaces with fine line features (screening can be used for patterns with lines greater than 0.002 inches, while photolithography can resolve line widths on the order of 0.5 nm).  Neither process can be readily adapted for vertical surface patterning.   However, lasers can be used to make patterns on three-dimensional (3-D) surfaces.

Description:  LLNL has developed an advance process for patterning using the technique of laser pantography (computer controlled laser direct-write patterning). The process uses commercially available electrodeposited photo-resist (EDPR) to pattern 3-D surfaces. A laser pantograph then patterns the EDPR, which is subsequently developed in a standard, commercially available developer, leaving patterned trench areas in the EDPR.   This then enables precision etching and plating operations. The process requires no micro-machining after the process is complete.

Advantages:   This technology provides a very accurate means of putting a metallic pattern on a curved surface without the need to perform micro-machining.

Potential Applications:   

•1)      Production of high-Q inductors on silicon

•2)      Manufacture of NMR micro-coils for high sensitivity spectroscopic analysis

•3)      Production of high density multichip packaging for electronic applications

•4)      Production of vertical chip stacks for much higher than normal DRAM or FLASH memory density

•5)      Fabrication of micro-stepper motors through laser patterned actuators

•6)      Fabrication of precision MRI steering coils on catheters

•7)      Patterning of non-planar printed circuit boards, including molded PCB's

•8)      Patterning of hard drive read heads

Development Status:  LLNL researchers have reduced the technology to practice and have used the process for "real world" applications.   The process is described in U.S. Patent #6,114,097

LLNL is seeking industry partners with a demonstrated ability to bring such inventions to the market. Moving critical technology beyond the Laboratory to the commercial world helps our licensees gain a competitive edge in the marketplace. All licensing activities are conducted under policies relating to the strict nondisclosure of company proprietary information. 

Please visit the IPAC website at http://www.llnl.gov/IPandC/workwithus/partneringprocess.php

for more information on working with LLNL and the industrial partnering and technology transfer process. 

Note:  THIS IS NOT A PROCUREMENT.  Companies interested in commercializing LLNL's Precision 3-D Laser Patterning Process technology should provide a written statement of interest, which includes the following:

1.   Company Name and address.

2.   The name, address, and telephone number of a point of contact.

•3.      A description of corporate expertise and facilities relevant to commercializing this technology.

Written responses should be directed to:

Lawrence Livermore National Laboratory

Industrial Partnerships and Commercialization

P.O. Box 808, L-795

Livermore, CA  94551-0808

Attention:  FBO 179-08

Please provide your written statement within thirty (30) days from the date this announcement is published to ensure consideration of your interest in LLNL's Precision 3-D Laser Patterning Process technology.